POU

Thermo-electric process thermostats for the semiconductor industry from -20 to 90 °C

The thermoelectric point of use (POU) temperature control system offers reproducible temperature control for plasma etching applications. This system dynamically controls the temperature of the electrostatic wafer chuck (ESC) and can be used in all types of etching processes. The LAUDA-Noah POU thermoelectric temperature control systems are based on established principles of heat transfer used for Peltier elements. These elements allow quick and precise temperature control required for complex processes involved in the manufacture of components progressively getting smaller and smaller in size.

Point of use (POU) temperature control systems can reduce energy consumption by up to 90 % compared to compressor-based systems. Minimal space requirements with the option of underfloor installation at the point of use minimizes cleanroom use. Quick and precise temperature control of the process temperature profiles to ±0.1 °C improves wafer-to-wafer homogeneity.

Working temperature min.

-20 °C

Working temperature max.

90 °C

POU 3300 POU 3500
Working temperature min. -20 °C -20 °C
Working temperature max. 90 °C 90 °C
Cooling output at 20 °C 1.2 kW 2.5 kW
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